neowin[.]net/news/intel-finally-responds-to-bending-12th-gen-alder-lake-cpus-on-lga1700-motherboards/
The socket design on LGA1700 motherboards apparently provides uneven pressure on their 12th gen CPUs, causing them to visibly bend. Considering the prices paid, many find this alarming. Intel says that while they continue to investigate, it's not a problem. Hard core gamers disagree...
CPUs produce a lot of heat, more so when overclocked, and heatsinks / coolers designed for maximum efficiency go to great lengths to keep them from throttling when temps get dangerously high. LOTS of attention is focused on the surface that mates with the CPU, which is often polished to a mirror-like surface. There's even all sorts of research & development on the best compound to use between the two, and exactly how to apply it -- there are pages with heatsink compound benchmarks. So, besides extra stress on the CPU & motherboard from this bending, when the CPU itself isn't flat, less heat is transferred away from the CPU, and it runs hotter. In one test, raising the socket by inserting 1mm washers lowers temps 5.76 °C.